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倒裝集成LED光源光電性能研究

時間:2019-06-07 10:00來源:畢業論文
研究了三種不同封裝形式的LED光源光電性能的對比。然后就電流對倒裝LED光源的光電性能的影響做了主要研究。并對研究過程中產生的問題,即散熱對光電性能的影響做了主要分析

摘要發光二極管(LED)作為新型的綠色照明光源,具有節能、高效、低碳、體積小、反應快、抗震性強等優點,可以為用戶提供環保、穩定、高效和安全的全新照明體驗,已經逐步發展成為成熟的半導體照明產業。而倒裝LED由于他的散熱性能與方便集成的特性在LED市場中扮演著重要的角色。分析倒裝集成LED也是迫在眉睫。在倒裝集成LED芯片制造和封裝過程中,除了要處理好穩定可靠的電連接以外,還需要處理光的問題。本文先是研究了三種不同封裝形式的LED光源光電性能的對比。然后就電流對倒裝LED光源的光電性能的影響做了主要研究。并對研究過程中產生的問題,即散熱對光電性能的影響做了主要分析。倒裝集成LED的光電性能與電流以及隨著電流上升的芯片溫度密切相關。36002
畢業論文關鍵詞:倒裝LED,集成光源,光電性能
Flip chip integrated LED light source photoelectric performance study
AbstractLight-emitting diode (LED) as a new type of green lighting light source, energy saving, high efficiency, low carbon, the advantages of small volume, fast response, strong vibration resistance, can provide users with environmental protection, stable, efficient and safe new lighting experience, has gradually developed into a mature semiconductor lighting industry. And flip chip LED due to the nature of his heat dissipation performance and convenient integration plays an important role in the LED market. Analysis of flip chip integrated LED is imminent. In the flip chip integrated LED chip manufacturing and packaging process, in addition to deal with stable and reliable electrical connection, you also need to deal with the issue of light. This paper first studied the three different encapsulation of LED light source in the form of photoelectric performance comparison. Then current effect the performance of the inversion of the LED light source photoelectric did the research. And the problems in the process of research, namely heat made mainly analyzes the influence of the optical performance. Flip chip integrated LED photoelectric performance and current and closely related with the current rise of chip temperature.
源¥自%六:維;論-文'網=www.aftnzs.live

KeyWords:Flip chip LED, Integrated light source photoelectric performance
目錄    1
目錄...2
第一章 緒論    ...5
1.1 課題背景    5
1.2 倒裝LED技術的發展及現狀    5
第二章 LED的封裝形式    8
2.1三種封裝形式    8
2.1.1正裝LED    8
2.1.2垂直LED    8
2.1.3倒裝LED    10
2.2倒裝芯片的優勢.10
2.3不同封裝形式對比實驗    11
2.3.1實驗目的    11
2.3.2實驗原理    11
2.3.3測試方法    11
2.3.4結果與討論    11
2.3.5色溫測試    14
2.4 結論    14
第三章  倒裝集成LED    14
3.1倒裝LED的制備工藝    14
3.1.1藍寶石襯底和GaN外延工藝技術    15
3.1.2倒裝LED圓片制程工藝    15
3.1.3倒裝LED芯片后段制程    16
3.2 倒裝LED的集成方式    16
3.2.1 貼片燈珠    16
3.2.2COB封裝    17
3.2.3 貼片燈珠    17
3.3 倒裝集成LED的光學特性    18
3.3.1 發光法向光強及其角分布    18
3.3.2 發光峰值波長及其光譜分布    18
3.3.3光通量    19
3.3.4發光效率和視覺靈敏度    19
3.3.5光通量    20
3.3.6發光效率和視覺靈敏度    21 倒裝集成LED光源光電性能研究:http://www.aftnzs.live/tongxin/20190607/34265.html
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